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ASCENT Theme 3 Liaison Meeting/High-performance fine pitch interconnects on Silicon Interconnect Fabric

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Location: Zoom

SivaChandra Jangam (UCLA) from Prof. Subramanian Iyer's Group will present "High-performance fine pitch interconnects on Silicon Interconnect Fabric" related to task: 2776.024 Fine-pitch Micro-aligned Heterogeneous Integration on Rigid Substrates.
 

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.