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ASCENT Theme 3 Liaison Meeting/Nanomaterial‐Based Thermal Management Solutions for 3D Monolithic Chips, Heterogeneous Integrated Substrates

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Location: Zoom

Speakers:  Chi Zhang (PhD Candidate), Mehdi Asheghi, and Ken Goodson (Stanford)

Nanomaterial‐Based Thermal Management Solutions for 3D Monolithic Chips, Heterogeneous Integrated Substrates This is related to Task 2776.053.

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.