Overview - Madhavan Swaminathan (5 mins)
Task 2776.036 - Kai-Qi Huang and Serhat Erdogan (30 mins)
Task 2776.035 - Mutee Ur Rehman (20 mins)
Q&A - 5 mins
Task 2776.036 Antenna Integration & Miniaturization
Antennas form an integral part of all wireless systems. In this presentation, we will discuss two approaches for antenna integration and miniaturization namely, i) 30GHz – 200+ GHz consistent with 5G, 6G, and ComSenTer applications and ii) 1-15GHz using magnetic materials. In the first approach, we make use of the current sheet concept to design arrays of highly coupled radiating elements, such as dipoles and patches that reduce aperture size and increase bandwidth. We also investigate new materials and fabrication processes to implement these antenna elements. In the second approach, we are investigating the use of magnetic current based antennas as an alternative to conduction current based antennas to break the dependence on existing fundamental size limit and achieve lower losses. This is based on work being done jointly with UC Berkeley using exciting magnetic materials coupled with surface acoustic waves that can lead to small antennas with high efficiency.
Task 2776.035 Surface Integrated RF Waveguides
RF Front Ends require feed structures that need to move energy around with a low loss. At THz frequencies, this can become challenging. In this work, we investigate the use of Surface Integrated Waveguides (SIW) as a replacement to microstrip and CPW structures at THz frequencies due to their higher-power handling capability, low loss, broadband performance, and low cross talk. SIWs can also be used for the design of filters, directional couplers, power dividers, antennas, and other passive components. By carefully understanding the role of surface roughness, dielectric losses and air cavities on the frequency response, we investigate the use of new materials, processes, structures and design techniques to minimize losses in the system.
This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.