ASCENT Theme 3(B) Liaison Meeting: Wafer Scale Rigid and Flexible Systems Technology

Title: "Wafer scale rigid and flexible systems technology" 

Presenter: Prof. Subramanian S. Iyer  (UCLA)

Related to Tasks: 2776.024 and 2776.025

Please note: This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons