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  3. ASCENT Theme 3 Liaison Meeting / Interconnect Technologies and Thermal Considerations for Dense Heterogenous 3D Systems

ASCENT Theme 3 Liaison Meeting / Interconnect Technologies and Thermal Considerations for Dense Heterogenous 3D Systems

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Location: zoom

Presenter: Muhannad Bakir, and students (Georgia Tech)

Abstract: This presentation will describe our efforts toward densely interconnected heterogeneous 3D systems. Testbeds have been designed and fabricated to enable ALD IO deposition between stacked ICs in collaboration with Theme 1 PIs. Electrical design considerations are highlighted. Moreover, thermal and thermomechanical models of dense 3D ICs based on our SoC+ approach are also presented. 

Tasks: 2776.048, 2776.049


This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.