ASCENT Theme 1(B) Liaison Meeting / Selective ALD


Location: webex


Chuck Winter: (a) Novel Ti precursors for TiSix and CoTi barrier layers. (b) New Co ALD precursors and processes. (c) Selective Co ALD for packaging. 

Steve George: (a) Bottom up fill of vias using Co EE-ALD. (b) Surface activation for continuous Co deposition using single electron pulse.

KJ Cho: (a) DFT of mechanism of ALD of thermal selective Co deposition. (b) DFT of antiferroelectrics and negative capacitance.

Adam Hock: (a) New precursors for TMD ALD; (b) ALD of semiconducting oxides for backend

Andrew Kummel: (a) Selective Ru ALD and selective Co ALD for packaging. (b) ALD of high crystallinity AlN layers for heat spreaders and RF.

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.