ASCENT Theme 3 Liaison Meeting / Signaling Figure of Merit for inter-die communication


Location: webex

Title: Signaling Figure of Merit for inter-die Communication

Presenters: ShivaChandra Jangam, Krutikesh Sahoo, and Subramanian Iyer (UCLA)

Abstract:  We will describe recent results on inter-die signaling and define a signaling figure of merit that accounts for shoreline bandwidth, silicon and packaging technology constraints such as CMOS node, interconnect and trace pitch and length, latency and energy per bit. We will compare a wide variety of signaling protocols and show that fine pitch interconnects such as the ones we are developing in ascent are at least an order of magnitude better than conventional protocols.

Tasks: 2776.024, .025


This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.