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ASCENT Theme 3 Liaison Meeting / Heterogeneous Integration for mmWave Applications

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Location: webex

Title: Heterogeneous Integration for mmWave Applications

Presenters: Students of Madhavan Swaminathan (Georgia Tech) 

Abstract:  We will discuss advances in glass-based packaging in the areas of material characterization, interconnects, waveguides, antenna integration, and chip embedding focused for D-Band (140GHz) applications. Some new ideas on thermal management will also be discussed.
 

Tasks: 2776.034, 035, 036
 

 

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.