Title: Heterogeneous Integration for mmWave Applications
Presenters: Students of Madhavan Swaminathan (Georgia Tech)
Abstract: We will discuss advances in glass-based packaging in the areas of material characterization, interconnects, waveguides, antenna integration, and chip embedding focused for D-Band (140GHz) applications. Some new ideas on thermal management will also be discussed.
Tasks: 2776.034, 035, 036
This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.