A joint presentation will be made on ALD for selective metal deposition and for metallic barrier deposition. The following topics will be included:
(a) Andrew Kummel (UCSD) – The effect of precursor and annealing on selective Ru deposition.
(b) KJ Cho (UT Dallas) – DFT modeling of Ru ALD reactions for selectivity and annealing effects
(c) Charles Winter (Wayne State) – Selective Co deposition for packaging and new Ti precursors for CoTi barrier and selective TiN deposition.
This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.