ASCENT Theme 4 Liaison Meeting /Description: NeuroSim Benchmark Towards 3D Integration


Location: webex

NeuroSim Benchmark Towards 3D Integration

Presenter: Xiaochen Peng,  PhD Student of Prof. Shimeng Yu (Georgia Tech)

Abstract: To investigate architecture-leveladvantages and challenges of 3DIC for compute-in-memory (CIM) architecture, weextend NeuroSim with new features includes: thermal profile modeling fortemperature-aware performance estimation; calibrated BEOL-compatible transistorparameters for monolithic 3D integration; and TSV diameter and parasitic forheterogeneous 3D integration.

We show two study cases of DNN-CIMplatforms with monolithic and heterogeneous integration respectively, and bysweeping tech-node and TSV diameter, we find the sweet spot for 3DIC in respectto electrical-thermal co-design.


This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.