ASCENT Theme 1B - Novel Processes and Materials for ALD nitrides, metals, and oxides

Novel Processes and Materials for ALD nitrides, metals, and oxides

Presenters: Steve George (UColorado), Andrew Kummel (UCSD), and KJ Cho, (UT Dallas)

An update will be given on novel materials and novel ALD techniques. Steve George – Electron enhanced ALD (EEALD) of reduced low work function metal (titanium) and ultra thin barrier layers (TiN), Andrew Kummel – Atomic Layer Annealing of AlN for heat spreaders and ALD inside horizontal vias; KJ Cho – DFT search for novel p-type oxides and simulations of ALA and EEALD.

Tasks: 
2776.001: Electron-Enhanced Atomic Layer Deposition 
2776.010: Self-aligned Monolayer (SAM) Enabled Interconnect Barrier at the Atomic Limit 
2776.058: Novel Routes to ALD of Crystalline Materials at Low Temperature 
2776.002: Multi-scale-DFT-KMC-PFM Modeling of Low Temperature Metal and TMD Growth
 2776.081: DSSP: RoadMap for Thermal Boundary Resistance for AlN and Diamond RF Heat Spreaders

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.