Integrated Glass Packaging for sub-THz Wireless Communication
Presenter: Madhavan Swaminathan (Georgia Tech)
In this presentation the latest advances and ongoing work in glass packaging will be presented as it relates to D-Band wireless communication. This includes antenna integration, chip embedding, heat removal, novel interconnect structures, fabrication process, and others.
Tasks: 2776.034, 035, 036, 077
This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.