Theme 1b / Novel Processing for ALD of Metal Films for Interconnect, Memory, and Packaging

Novel Processing for ALD of Metal Films for Interconnect, Memory, and Packaging

Repeat Session

The groups of Andrew Kummel (UCSD), Chuck Winter (Wayne State), and Steve George (U Colorado) will present recent experiments on ALD of metals.  (a) Kummel will present an ALD for Ru which produces films with bulk-like resistivity for a semidamascene process.  Kummel will also present on a thermal halogen-free TiN ALD for horizontal interconnects with a resistivity nearly equal to ALD with the best halogen precursor.  (b) Winter will present on novel Co precursors of Co ALD in packaging.  The selective Co ALD can be used for chip to chip bonding thereby replacing compression bonding.  (c) Steve George will present on halogen- free, low temperature EEALD (electron enhanced ALD) of TiN with record low resistivity due to near zero residual carbon and oxygen.  Progress on EE ALD of Ru will be provided.

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.