ASCENT Annual Review Poster Session
More than 165 ASCENT research faculty, students and sponsors attended the second ASCENT Annual Review on August 13-15, 2019 at the University of Notre Dame campus. The event started with the "Emerging Hardware for Bio-Inspired Computing Workshop" held in the Morris Inn Smith Ballroom on Aug 13. The four-center workshop consisted of a variety of talks on recent progress in smart interconnect, spin, and ferroelectric based spiking neurons as well as stochastic synapses that are being pursued along with the ASCENT center in the following three centers: NEW LIMITs, CAPSL, and C-BRIC. The three visiting centers are located at Purdue University in West Lafayette, IN.
The ASCENT review was held August 14 -15 at the Jordan Hall of Science. The review consisted of one and 1/2 days of presentations, with companion poster sessions. The Review dinner was held on Aug 14 in Downes Club, Corbett Family Hall, which overlooks the Notre Dame stadium. University Provost Thomas Burish, opened the dinner with a warm welcome to the ASCENT community. Brian Cline, Principal Research Engineer in the Devices, Circuits, and Systems research group at Arm provided a presentation on "Amuse-Bouche: From small bytes to big chips and the importance of thinking vertically” at the dinner.
Congratulations go to the following nine ASCENT students for receiving recognition for the review's "best poster awards". The awards were based on technical content, visual presentation, and alignment with the Center vision. They were selected by the SRC Science Advisory Board members during the three poster sessions.
Theme 1 • Vertical CMOS
“Towards BEOL compatible 2D semiconductor transistors”
Connor McClellan & Connor Bailey (Stanford)
“Electrically triggered IMT phase transition in LaCoO3 for cross-point
selector applications” Ben Grisafe (Notre Dame)
Theme 2 • Beyond CMOS
“Thickness scaling of an improper ferroelectric” Rachel Steinhardt (Cornell)
“Asynchronous computing with p-bits” Ahmed Zeeshan Pervaiz (Purdue)
Theme 3 • Heterogeneous Integration Fabric
“Exploring electroless plating and ALD processes to demonstrate low
temperature, pressureless, and misalignment tolerant bonding process
for extreme fine pitch interconnects and using sacrificial reflowed photoresist
to demonstrate <2 μm self-alignment” Carl Li (Georgia Tech)
“Nanomaterial-based thermal management solutions for 3D monolithic chips,
Heterogeneous integrated substrates” Sougata Hazra (Stanford)
Theme 4 • Merged Logic Memory Fabric
“Ternary content-addressable memories based on ferroelectric hafnium
zirconium oxide” Ava Tan (UC Berkeley)
“Hardware efficient Boltzmann machines for combinatorial optimization”
Saavan Patel (UC Berkeley)
