SivaChandra Jangam is a Ph.D. candidate in the Electrical and Computer Engineering department at University of California, Los Angeles (UCLA) under the Center for Heterogeneous Integration and Performance Scaling (CHIPS) led by Professor Subramanian Iyer. As a member of UCLA CHIPS team, SivaChandra was integral in the development of the Silicon Interconnect Fabric (Si-IF) technology which is a 10 µm fine-pitch heterogeneous integration platform. Further, he developed the Simple Universal Parallel intERface for chips (SuperCHIPS) protocol for near chip communication on the Si-IF that achieves high bandwidth at low power and is currently working to demonstrate a high-performance system using the Si-IF and SuperCHIPS interface.
Siva is the recipient of the Electronics Packaging Society (EPS) Ph.D. fellowship 2019 and the Guru Krupa Fellowship 2017. He was also awarded the “Intel Best Student Paper” in the 2017 at the Electronic Components and Packaging Conference (ECTC) for his work on the fine-pitch integration methodologies. In addition, he received the “Outstanding student paper award” at the 2018 International Microelectronics Symposium (IMAPS) for his work on characterization of the Si-IF assemblies.
Before joining UCLA, Siva received his Bachelor of Tech. degree in Electrical Engineering from Indian Institute of Technology Kanpur, (IIT Kanpur) India where he worked on modeling and applications of novel devices.