JUMP e-Workshop: Next Generation System on Package (SoP) Technologies for Heterogeneous Integration

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Location: via WEBEX

Madhavan Swaminathan (GA tech) will discuss advanced SoP platforms for integration with a focus on heterogeneity for a variety of mixed-signal applications being pursued within the ASCENT Center. 

Abstract: A combination of "Moore" (IC) and "More than Moore" (package) scaling has led to the shrinking of electronic systems over the last several decades. As scaling continues beyond CMOS to include advanced devices, scaling of the package needs to continue to enable integration and miniaturization of systems. This requires new technologies for package integration which when connected to assembled ICs leads to System on Package (SoP) solutions that have superior performance and size as compared to current technologies. This presentation will discuss advanced SoP platforms for integration with a focus on heterogeneity for a variety of mixed-signal applications being pursued within ASCENT. 

Bio: Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech. Prior to joining Georgia Tech, he was with IBM working on packaging for supercomputers. He is the author of 450+ refereed technical publications, holds 30 patents, primary author and co-editor of 3 books, founder and co-founder of two start-up companies (E-System Design and Jacket Micro Devices) and founder of the IEEE Conference Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the Electronics Packaging Society (EPS). He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE EMC society. He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.


This e-Workshop is only available to the JUMP research community, such as Principal Investigators, postdoc researchers, students, and corporate sponsors. ASCENT is one of six JUMP centers administered by the Semiconductor Research Corporation. Thank you for interest in ASCENT.