ASCENT Liaison Meeting/Benchmarking

Presenter: Azad Naeemi group (Georgia Tech)

Topics Covered:
1. Design and Benchmarking for Various Magnetic Memory Options 
2. A Comprehensive Benchmarking Framework for Back End of Line Technology

Tasks:
2776.060: Modeling for Novel Materials, Devices, Interconnects, and Packaging Solutions
2776.061: Benchmarking for Novel Materials, Devices, Interconnects, and Packaging Solutions

Please note: This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons