Presenter: Muhannad Bakir, and students (Georgia Tech)
Abstract: This presentation will describe our efforts toward densely interconnected heterogeneous 3D systems. Testbeds have been designed and fabricated to enable ALD IO deposition between stacked ICs in collaboration with Theme 1 PIs. Electrical design considerations are highlighted. Moreover, thermal and thermomechanical models of dense 3D ICs based on our SoC+ approach are also presented.
Tasks: 2776.048, 2776.049
This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.