ASCENT Theme 3 Liaison Meeting / PowerTherm - A unified power delivery and heat extraction scheme for high performance wafer Scale systems

PowerTherm - A unified power delivery and heat extraction scheme for high performance wafer Scale systems

Author list: U. Mogera, K.T. Kannan, Ujash Shah, T.J. Fisher and S.S. Iyer (UCLA)

Abstract: At Ascent@UCLA we are developing a novel and unified power delivery and heat extraction unit for high performance wafer scale systems.The goal is to develop a system that can deliver 50KW of power and dissipate a similar amount in a compact form factor. The challenge of wafer scale systems has to do with the fact that unlike in conventional PCB/MCM based systems, the heterogeneous dielets abutt each other leaving little room for heat spreading. Thus all the heat needs to be extracted perpendicularly from the wafers scale system. This is the biggest challenge as we develop a "Moore's law" for packaging. Simultaneously, since the real estate on the Heterogeneous Silicon wafer Integration platform (called the Silicon Interconnect Fabric) is precious, there is little room for the power delivery electronics to placed on the Si IF. Our scheme called PowerTherm uses "pfins" to both deliver the power and extract the heat. This talk will describe the progress we have made in the development of these novel concepts and their implementation. After a brief introduction of the concepts, the talk will address three issues:

a. PowerTherm assembly - Umesha Mogera 

b. Electrical performance including deep trench decoupling - K.T Kannan

c. Thermal performance including liquid and two phase cooling - Ujash Shah

ASCENT Task: 2776.055

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.