Millimeter Wave Packaging and Integration
Presenters: Mutee Rehman, Kai-Qi Huang, Siddharth Ravichandran & Madhavan Swaminathan (Georgia Tech)
Description: In this presentation we will discuss our ongoing work related to glass based packaging with advanced polymer materials for D-Band applications. Integration of antennas, waveguides, passive devices and embedded dies in cavities using fanout panel level packaging will be covered along with characterization of the materials.
ASCENT Tasks: 2776.034, .035, and .036
This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.