ASCENT Theme 3 Liaison Meeting / Millimeter Wave Packaging and Integration

Millimeter Wave Packaging and Integration

Presenters: Mutee Rehman, Kai-Qi Huang, Siddharth Ravichandran & Madhavan Swaminathan (Georgia Tech) 

Description: In this presentation we will discuss our ongoing work related to glass based packaging with advanced polymer materials for D-Band applications. Integration of antennas, waveguides, passive devices and embedded dies in cavities using fanout panel level packaging will be covered along with characterization of the materials.

ASCENT Tasks: 2776.034, .035, and .036

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.