ASCENT Theme 3 Liaison Meeting /Development of a High Heat Flux Capillary-fed Micro-cooler using Copper Inverse Opal (CIO) Porous Structure and 3D manifold Liquid/Vapor Routing
Development of a High Heat Flux Capillary-fed Micro-cooler using Copper Inverse Opal (CIO) Porous Structure and 3D manifold Liquid/Vapor Routing
Presenters: Qianying Wu, Sougata Hazra, Chi Zhang, Mehdi Asheghi and Ken Goodson Stanford University (Stanford, California)
Abstract: Thermal-power challenges and increasingly expensive energy demands pose threats to the historical rate of increase in processor performance. Energy-efficient computing and heterogeneous integration promise substantial reduction in energy demand for emerging and growing computing needs. However, these conflicting trends have resulted in a substantial increase in both heat flux and power density, which reduced the efficacy of conventional cooling technology solutions.
Our group has focused for many years on leading-edge heat sinks using microfabrication and integration strategies, in collaboration with SRC member companies. Here we report progress on development of a high performance micro-cooler capable of removing a heat flux of ~1 kW/cm2 with a temperature superheat near 20oC, yielding a thermal resistance, R”th < 0.05 cm2 oC/W. This represents a 10× reduction in thermal resistance compared to the state-of-the-art cooling technologies that greatly increases the efficiency, resulting in improved performance and reliability for microprocessors. We utilize liquid wicking (no pumping) and thin-film evaporation in a 30 µm thick novel copper inverse opal (CIO) porous structures over an exchange length of 500 µm in conjunction with a silicon-based 3D manifold with liquid routing and vapor extraction conduits. This talk will highlight the design and optimization of the critical capillary wicking length in CIOs as well as the simulation of the pressure and temperature drop, and will also assess long-term opportunities and challenges for integration and impact on chip design.
Task 2776.053: Nanomaterial-Based Thermal Management Solutions
Bios of presenters:
Ken Goodson is the Senior Associate Dean for Faculty and Academic Affairs in the School of Engineering at Stanford, where he recently chaired the Mechanical Engineering Department. Goodson specializes in heat transfer and electronics cooling and has a 27 year track record working with the SRC. His group is renowned for translating breakthrough cooling science and thermal instrumentation to companies. Goodson is a member of the National Academy of Engineering and a Fellow with ASME, IEEE, APS, AAAS, and the National Academy of Inventors. He received the SRC Aristotle Award, ASME Kraus Medal, the inaugural IEEE Richard Chu Award, the AIChE Kern Award, and the Heat Transfer Memorial Award. For over two decades, Professor Goodson has cultivated a renowned association with SRC and its industry members. He began working with SRC in the early 90s as a Ph.D. student at MIT under Professor Dmitri Antoniadis (2014 Aristotle Award, 2017 Technical Excellence Award). Professor Goodson went on to become a professor at Stanford with his first research contract being sponsored by SRC.
Qianying Wu is a PhD candidate in Stanford Nanoheat lab, working on the design and fabrication of microporous wicking materials for capillary-driven two-phase heat and mass transfer, the simulation and integration of such engineered materials in novel high heat flux cooling devices, and exploring ways to utilize these technologies for positive energy and sustainability impact. Qianying graduated with her B.S with top honors from Tsinghua University in 2018.
Dr. Chi Zhang received her B.S. with honors in Mechanical Engineering with a focus on Micro-Electro-Mechanical Systems (MEMS) from Tsinghua University in 2013. She received her doctorate degree in Mechanical Engineering at Stanford University under the advisement of Professor Kenneth Goodson in 2019. Her research interests lie in understanding heat and mass transport in micro- and nanoscale. She is working on high heat flux electronic cooling with phase change processes in micro/nanostructures.
Please note: This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.