1. Home ›
  2. Events ›
  3. ASCENT Theme 3 / Integrated Glass Packaging for sub-THz Wireless Communication

ASCENT Theme 3 / Integrated Glass Packaging for sub-THz Wireless Communication

-

Location: webex

Integrated Glass Packaging for sub-THz Wireless Communication

Presenter: Madhavan Swaminathan (Georgia Tech)

In this presentation the latest advances and ongoing work in glass packaging will be presented as it relates to D-Band wireless communication. This includes antenna integration, chip embedding, heat removal, novel interconnect structures, fabrication process, and others.

Tasks: 2776.034, 035, 036, 077

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.