ASCENT Theme 3 / 3D Polylithic Integration technologies

3D Polylithic Integration technologies

Time: 4:00pm Eastern

Presenters: Ankit Kaul, Madison Manley, Ashita Victor (Prof. Muhannad Bakir's group, Georgia Tech)

Abstract:
In this talk, we present our vision for dense 3D polylithic integrated circuits. The key enabling technologies that will be discussed are : 1) low-temperature ICP-PECVD SiO2 reconstitution of silicon chiplets at the wafer level, and 2) ALD-based bonding technology. The status of the technologies, current testbeds, and benchmarking to existing solutions will be presented. We will also discuss the modeling of the proposed 3D polylithic integrated circuits accounting electrical, thermal, and implications at the system level for ML systems. 

Theme 3 Tasks covered:  
2776.048: Ultra-Dense Heterogeneous Integration Interconnect and Assembly
2776.049: Embedded Cooling, Thermal-Electrical Co-Design, and Benchmarking of Options
2776.050: System Demonstrator for Neuromorphic Computing Through Logic, FPGA, and Memory Hetero. Integration

This meeting is only available to the JUMP research community, such as Principal Investigators, Postdoc researchers, Students, and Industry/Government liaisons.